Infineon CoolMOS™ G7 and CoolSiC™ G6 for high power applications

The benefits of the already existing high voltage technologies 600 V CoolMOS™ G7 superjunction (SJ) MOSFET and CoolSiC™ Schottky diode 650 V G6 get combined with the innovative concept of top-side cooling, providing a system solution of high current hard switching topologies and a high-end efficiency solution for LLCs.

This brand new packaging solution enables fast switching and high efficiency in reduced size and weight with a minimized total cost of ownership (TCO).

Key features

• Fist top side cooled SMD solution/innovative cooling concept
• Chopper current limitation
• Short circuit shut down with latch behavior
• Detailed SPI diagnosis or simple error flag

Additional features

• Inbuilt 4th pin Kelvin source configuration and low parasitic inductance
• TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb free

• Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits

• Reduced parasitic source inductance improves efficiency and ease-of-use

• Enables higher power density solutions

• Exceeding the highest quality standards

CoolMOS™ G7 and CoolSiC™ G6 related features and benefits:

• CoolMOS™ G7 offers BiC FOM RDS(on) x EOSS and RDS(on) x Qg

• CoolSiC™ Gen 6 offers BiC VF and FOM QG x VF

• CoolMOS™ G7 and CoolSiC™ Gen 6 as effective combination of the high-end efficiency market segment

Applications

• High Power SMPS Applications
• Server
• Telecom
• PC Power
• Solar

Available tools

EVAL_1K6W_PSU_G7_DD
Family: MOSFET, Diode (Si, SiC), Gate Driver, CoolSET™, Microcontroller

Description: 1600W Titanium server power supply with 600V CoolMOS™ G7 superjunction MOSFET in DDPAK package

• 1EDI20N12AF
• 2EDN7524F
• BSC007N04LS6
• ICE2QR2280G
• IDDD08G65C6
• IPDD60R050G7
• IPDD60R150G7
• XMC1402-Q040X0128 AA
• XMC4200-F64K256 BA