Infineon 650 V ultra-thin TRENCHSTOP™ 5 in D2Pak
The new TRECHSTOP™ 5 IGBT in D2Pak expands the limits of surface mounted devices to the higher power range competing now with D3Pak and through hole TO-247 packages
Ultra-thin TRENCHSTOP™ 5 IGBT technology from Infineon allows higher power density in smaller chip size. Infineon is the first on the market able to fit 40 A 650 V IGBT with 40A diode in D2Pak package – 25% higher than any other competitor offering maximum 30A Duopack IGBT in D2Pak.
The new TRECHSTOP™ 5 IGBT in D2Pak expands the limits of surface mounted devices to the higher power range competing now with D3Pak and through hole TO-247 packages.
Key features
- Highest power density 650V IGBT in D2Pak footprint
- Unique 40A 650V IGBT Duopack in D2Pak footprint
- Best-in-class fast speed switching H5 or medium-speed optimized S5 TRENCHSTOP 5 IGBT
- /
Additional features
- Best –in-class fast speed switching H5 or medium-speed optimized S5 TRENCHSTOP™ 5 IGBT technology
- Higher power design with D2Pak package
- Upgrade of the available designs for higher power output
- Less paralleling - > higher reliability
- Smaller PCB, more compact system design, smaller weight
Applications
- Welding
- UPS
- Battery Chargers
- Solar
- Drives
Do you have a Question?
Contact EBV
If you need any assistance, please click below to find your closest EBV sales office.
Related links |
Related markets |
Related technologies |