Nexperia Automotive MOSFETs in LFPAK33 trench 6 portfolio
The LFPAK33 is the ultimate in automotive MOSFET performance within a compact power footprint.
Bringing Nexperia’s robust and reliable copper clip technology to the Power33 (3.3 mm x 3.3 mm) footprint.
The LFPAK33 is the ultimate in automotive MOSFET performance within a compact power footprint. It is an extension of the LFPAK family into smaller power systems.
The LFPAK33 uses advanced copper clip technology and its portfolio can address a wide range of automotive applications.
The LFPAK33 supports easy optical inspection and enhanced board level reliability.
The LFPAK33 is footprint compatible with alternative packages in the power33 footprint
Key features
- Ultra-compact footprint – 10.9 mm²
- Thermal performance – no wires, no glue, 175° C Tj max
- Electrical performance low pack. resistance and inductance
- Mechanical robustness
Additional features
- Ultra-compact footprint – 10.9 mm²
- Thermal performance – no wires, no glue, 175° C Tj max
- Electrical performance – low package resistance and inductance, up to 70 A ID max rating
- Mechanical robustness – Exposed leads absorb thermal and mechanical stresses
- Manufacturability – Exposed leads allows for easy optical inspection
Applications
- Braking (ABS / ESP)
- Engine management
- Transmission
- Automotive lighting
- Water pump
- Oil pump
- Fuel pump
- Electric park brake
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