Infineon Eco Block modules in solder bond technology
Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must.
Infineon Technologies Bipolar extended their Eco Line with 34 mm and 50 mm TT and TD modules in 1800 V – additionally to the 1600 V portfolio.
Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, UPS and welding.
Key features
- Cost effective solution for higher competitiveness
- Predictably high performance and lifetime due to 100% x-ray
- Solid base plate for fast and easy mounting
- One-stop-shop due to complete module technology portfolio
Additional features
- Current 160 A – 320 A
- Blocking Voltages: 1800 V
- Industrial standard package
- Electrically insulated copper base plate
Applications
- Input Rectifier for Drives
- Low and Medium Voltage Soft Starter
- Input Rectifier and Bypass for UPS
- Static Switch
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