Infineon BSZ0909ND half-bridge optimized solution
Infineon optimized solution for wireless power, drives and wearables
EBV presents BSZ0909ND:
Used OptiMOS™ technology combined with the PQFN 3x3 package offers an optimized solution for DC-DC applications with space critical requirements.
Key features
- Ultra-low Qg
- Half-bridge in a small 3.0x3.0 mm² package outline
- Exposed pads
- Logic level (4.5 V rated)
Benefits:
- Low switching losses
- High switching frequency operation
- Lowest parasitics
- Low operating temperature
- Low gate drive losses
- RoHS 6/6 lead free product
Applications
- Wireless
- Drives (e.g. Multicopter)
Do you have a Question?
Contact EBV
If you need any assistance, please click below to find your closest EBV sales office.
Related links |
Related markets |
Related technologies |