Infineon 1EDI EiceDRIVER™ Compact 300mil

1EDI EiceDRIVER™ Compact 300mil are compact drivers in a wide body package for increased creepage distance, improved thermal behavior, and optimized pin out. These galvanically isolated drivers are based on Infineon’s coreless transformer technology, enabling a world class common mode transient immunity of 100 kV/μs. With current drive strengths of up to 6 A on separate output pins for sourcing and sinking, they are ideal for IGBT based applications such as photovoltaic string inverters, charge stations for electric vehicles, industrial drives, welding equipment, induction heating appliances.

Key features

• Single channel high-voltage gate driver IC
• 1200 V input-to-output isolation voltage
• DSO-8 300 mil wide body package with 8 mm creepage distance
• Separate source and sink outputs or active Miller clamp

Additional features

Features:

• Single channel high-voltage gate driver IC
• 1200 V input-to-output isolation voltage
• DSO-8 300 mil wide body package with 8 mm creepage distance
• Drives high voltage power MOSFETs and IGBTs
• Up to 6 A minimum peak rail-to-rail output
• Separate source and sink outputs or active Miller clamp

Benefits:

• Very low propagation delay of 300 ns or 125 ns (high-speed IGBT versions)
• Propagation delay mismatch trimmed down to less than 10 ns
• Optimized pin-out for low impedance power supply
• 100 kV/µs minimum common-mode transient immunity (CMTI)
• No need to adapt signal voltage levels between μController and driver

Applications

• General purpose inverters
• Industrial drives
• Photovoltaic inverters
• Charge stations for electric vehicles
• Welding equipment
• Commercial, construction and agricultural vehicles (CAV)